Solder Paste Relife RL-401 183ºC

Low-Melt Solder Paste for Precision Repairs

Relife RL-401 solder paste is a low-temperature solder flux solution, specifically formulated for delicate work on printed circuit boards (PCBs). With a precise melting point of 183°C, it ensures controlled and safe application on heat-sensitive components, such as those found in mobile phones, tablets, and laptops.

Technical Specifications

• Brand: Relife
• Model: RL-401
• Melting Point: 183°C (Low Temperature)
• Alloy Composition: Sn63/Pb37 (Tin/Lead)
• Viscosity: 178 +/-10 pa.s
• Granulometry: 20-38µm
• Main Application: SMD, BGA Repair, Reballing
• Content: 35g

What Distinguishes This Model

The main differentiator of Relife RL-401 is its 183°C melting point, which classifies it as a low-temperature paste. This feature is crucial for preventing thermal damage to modern, densely populated components, allowing for repairs that would be risky with higher-temperature solders. Its consistency and fine granulometry ensure uniform application through a stencil and excellent wettability.

Usage / Installation Tips

For best results, store the solder paste in the refrigerator to maintain its viscosity and extend its shelf life. Before use, allow it to reach room temperature for at least 2 hours to prevent condensation. Apply the minimum amount necessary to cover the pads, ensuring a clean and reliable solder joint.

Micro Wire Quality Seal

Each package of Relife RL-401 solder paste is inspected by our technical team before shipping. We verify the integrity of the seal and the expiry date to ensure you receive a fresh product in perfect working condition, guaranteeing flawless repairs.

Frequently Asked Questions

Is this solder paste suitable for repairing iPhones?

Yes, the 183°C melting point is ideal for many microsoldering jobs on iPhone logic boards and other mobile phones, especially for reballing ICs that cannot withstand higher temperatures.

What is the difference between this and a lead-free paste?

This paste contains a tin/lead alloy (Sn63/Pb37), which has a lower melting point and is generally easier to work with than lead-free alloys (SAC), which melt at temperatures above 217°C. The choice depends on the repair requirement and the original solder of the component.

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