High Quality Reballing Stencil iPhone 13 13 Mini 13 Pro and Max

High Quality Reballing Stencil iPhone 13 Series – Precision for Professional Repairs

This reballing stencil was designed with laser cutting technology to ensure perfect alignment of BGAs (Ball Grid Array) on iPhone 13 series processors. Manufactured from high thermal resistance steel, it prevents deformation during the heating process, ensuring a reliable and durable motherboard repair. It is the ideal choice for technicians seeking maximum precision and efficiency, minimizing the risk of failures and rework.

Technical Specifications

• Compatibility: iPhone 13, iPhone 13 Mini, iPhone 13 Pro, and iPhone 13 Pro Max
• Material: High-density steel with high-temperature resistance
• Manufacturing Technology: High-precision laser cutting for perfect alignment of solder balls

Installation and Usage Tips

We recommend that installation be performed in a clean, static-free environment. Use appropriate tools and always test the component before closing the device to ensure maximum performance.

Micro Wire Quality Seal

At Micro Wire, each product undergoes rigorous manual quality control. We meticulously check the touch, visual integrity, and connections, ensuring a defect-free part ready for installation.

Invest in Micro Wire quality and elevate the level of your repairs.